“Oriented Growth” in Primary Recrystallization

Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire

Tough pitch copper wire (99.97% Cu) is generally characterized by the spiral elongation number. The principle of the test is based on the influence of impurities on the recrystallization kinetics. Alternative non-metallographic techniques to characterize the recrystallization kinetics have been investigated in this study, such as differential scanning calorimetry (D.S.C.) and residual electrica...

Crystal Growth: Substructure and Recrystallization

Secondary recrystallization characteristics of 3%Si grain-oriented electrical steel

A secondary recrystallization Lab study focusing on the secondary recrystallization temperature and magnetic properties was carried out on cold rolling industrial samples of 3%Si grain-oriented electrical steel produced by low slab reheating temperature technology. The results showed a secondary recrystallization temperature, determined by the observed grain size change, of 1080 C with annealin...

Recrystallization and Grain Growth of Gold bonding Wire

Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The textures of the drawn gold wires contain major <111>, minor <100> and small fractions of complex fiber components. The <100> oriented regions are located in the center and surface of the wire, and the complex fiber component regions are located near the surface. The ...

Recrystallization and Grain Growth of Cold drawn Gold bonding Wire

Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The bonding wires were wire-drawn to an equivalent strain greater than 11.4 with final diameter between 25 and 30μm. Annealing treatments were carried out in a salt bath at 300°C, 400°C for 1 min, 10 min, 60 min, and 1 day. The textures of the drawn gold wires contain ma...